The AMD XCKU9P-1FFVE900I, part of the high-performance Kintex® UltraScale+™ FPGA series, is crafted with precision engineering to cater to demanding computing environments. This component features a robust package in a 900-BBGA, FCBGA form factor designed for surface mounting, enabling streamlined integration into a wide range of applications. With an impressive 599,550 logic elements and 34,260 LABs/CLBs, it stands out for its capability to handle complex data processing and algorithm execution tasks efficiently.

Operating within a temperature range of -40°C to 100°C (TJ), the XCKU9P-1FFVE900I ensures reliability and performance stability under various environmental conditions, making it suitable for industries requiring high precision and durability. Furthermore, it comes equipped with 304 I/O pins, providing ample connectivity options for interfacing with other components in a system.

The FPGA boasts a substantial total RAM bits of 41,881,600, underscoring its ability to support high-density storage requirements and data-intensive applications. Packaged in bulk with a 900-FCBGA (31×31) supplier device package, this part maintains an active status, ensuring availability and support for ongoing and future projects.

With its advanced features and capabilities, the XCKU9P-1FFVE900I is an ideal choice for developers and engineers working on cutting-edge projects in fields such as telecommunications, data processing, aerospace, and beyond, where performance and reliability are paramount.