The XCKU095-1FFVC1517C by AMD is a high-performance FPGA from the Kintex® UltraScale™ series, tailored for complex digital signal processing and high-speed networking applications across various industries, including telecommunications, data processing, and aerospace. This component is offered in a 1517-BBGA, FCBGA package, optimized for surface mount technology, facilitating seamless integration into a wide range of electronic assemblies.

With an operating temperature range of 0°C to 85°C (TJ), this FPGA is designed to withstand the rigorous demands of high-speed, high-temperature environments. It boasts 1,176,000 logic elements/cells and 67,200 LABs/CLBs, providing a robust platform for complex logic circuit implementation. Its substantial total RAM bits of 60,518,400 and 520 I/O pins support extensive data storage and high-speed data transfer capabilities.

The component is housed in a 1517-FCBGA (40×40) supplier device package, emphasizing its compactness and the efficiency of its design, which ensures compatibility with a modern, minimal-footprint board design. It is currently available in bulk packaging, ensuring it meets the volume requirements of both small and large-scale projects.

By leveraging the power and flexibility of the XCKU095-1FFVC1517C, engineers and designers can push the boundaries of what’s possible in electronic design, creating systems that are more efficient, reliable, and capable of handling increasingly complex tasks. Its active part status assures customers of its availability and continued support for their ongoing and future projects.