The XCKU060-L1FFVA1156I, produced by AMD, falls into the category of Field Programmable Gate Arrays (FPGAs) within the advanced Kintex® UltraScale™ series. This component is ideal for high-performance applications requiring rapid processing and versatile logic configuration. It is delivered in bulk packaging, with the unit itself encased in a 1156-Ball Fine-Pitch Ball Grid Array (1156-FCBGA) package, accommodating surface mount technology for efficient assembly and space conservation on PCBs.

Operating within a temperature range of -40°C to 100°C (TJ), this FPGA is designed to sustain reliability and performance under a range of environmental conditions, making it a suitable choice for demanding industrial, telecommunications, and data processing applications. The device is characterized by its substantial logic capacity, featuring 725,550 logic elements/cells and 41,460 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs) which provide the flexibility and scalability necessary for complex digital circuits.

Additionally, the XCKU060-L1FFVA1156I offers a vast 38,912,000 total RAM bits, enabling efficient data management and high-speed processing. Coupled with 520 I/O pins, this component facilitates comprehensive connectivity and integration capabilities within a system. With its active part status, it remains a reliable choice for current and future high-grade applications.

The substantial capacity of logic elements, coupled with the large amount of RAM and numerous I/O ports, underscores the component’s utility in creating dense, powerful computing arrays essential for innovative technology solutions across various industries. This model is an exemplar of AMD’s commitment to delivering cutting-edge technology that meets the intricate requirements of contemporary digital systems.