The XCKU035-2FBVA676I is a cutting-edge FPGA from AMD’s Kintex® UltraScale™ series, designed to meet the rigorous demands of high-performance applications in a wide range of industries including telecommunications, automotive, defense, and aerospace. This device is characterized by its 676-BBGA (FCBGA) package, optimized for surface-mounted technology, ensuring a robust and reliable integration into complex systems.

Operating within a temperature range of -40°C to 100°C (TJ), this FPGA ensures reliability and performance under extreme conditions, making it an ideal choice for mission-critical applications. With an impressive number of 444,343 logic elements/cells and 25,391 LABs/CLBs, it provides the necessary flexibility and capacity for implementing complex logic functions. Its substantial total RAM bits of 19,456,000 support intensive data-processing tasks, accommodating the needs of data-heavy operations.

Equipped with 312 I/O ports, the XCKU035-2FBVA676I facilitates extensive connectivity options, enabling the design of scalable and adaptable systems. The part is supplied in bulk packaging, indicating its readiness for volume deployment in industrial applications. As an active component, it remains a preferred choice for developers looking for high-performance FPGA solutions.

The XCKU035-2FBVA676I from AMD’s Kintex® UltraScale™ series is not just an FPGA; it’s a strategic choice for innovators and designers aiming to leverage superior processing power, flexible configuration, and robustness in their next-generation systems.