Explore the advanced capabilities of AMD’s Virtex®-7 T Series FPGA, part number XC7V2000T-1FLG1925C. This field-programmable gate array sets a high standard in the FPGA technology space, encapsulated in a 1924-BBGA, FCBGA package for superior performance. The device is engineered for surface mount applications, ensuring seamless integration into a variety of designs.

Featuring an immense number of logic elements/cells totaling 1,954,560 and supported by 152,700 LABs/CLBs, this FPGA provides unparalleled flexibility and capacity for complex logic circuits. Its substantial total RAM bits of 47,628,288 further enhance its capability to handle extensive data processing tasks efficiently.

The XC7V2000T-1FLG1925C operates over a temperature range of 0°C to 85°C (TJ), making it suitable for a wide range of environments. With a package size of 1925-FCBGA (45×45), this FPGA is designed to meet the needs of high-demand applications, confirming its robustness and versatility.

Key specifications include:
– Packaging: Tray, ensuring safe and secure handling.
– Mounting Type: Surface Mount, for efficient assembly processes.
– Operating Temperature: 0°C ~ 85°C (TJ), covering a broad spectrum of environmental conditions.
– Number of Logic Elements/Cells: 1,954,560, for high-density logic designs.
– Supplier Device Package: 1925-FCBGA (45×45), offering a compact and efficient footprint.
– Number of LABs/CLBs: 152,700, facilitating complex programmable logic.
– Total RAM Bits: 47,628,288, enabling significant data storage and processing.
– Part Status: Active, ensuring ongoing availability and support.
– Number of I/O: 1200, providing extensive connectivity options.

The XC7V2000T-1FLG1925C is widely adopted across several industries, including telecommunications, data processing, aerospace, and defense, for its reliability, scalability, and performance. This FPGA by AMD is a testament to sophisticated engineering, designed to meet the demanding requirements of next-generation electronic systems.