The XC7K410T-3FFG676E, a notable FPGA from AMD’s Kintex®-7 series, underscores a blend of performance, power efficiency, and cost-effectiveness designed to meet the rigorous demands of various application sectors. With its 676-FCBGA (27×27) package housed in a 676-BBGA, FCBGA casing, this component is optimized for surface-mount technology, ensuring a robust and reliable integration into a broad range of electronic assemblies.

Featuring an impressive array of 406,720 logic elements/cells and 31,775 LABs/CLBs, the XC7K410T-3FFG676E provides a flexible and scalable architecture that is well-suited for complex digital signal processing (DSP) applications, high-speed networking, and telecommunication systems. The device operates effectively within a temperature range of 0°C to 100°C (TJ), catering to environments that demand high thermal resilience.

Equipped with a vast 29,306,880 total RAM bits and 400 I/O pins, this FPGA offers ample storage and connectivity options to facilitate intricate designs and interfaces. Its active status in the market confirms its ongoing relevance and availability for both new designs and legacy support in various industries, including but not limited to, aerospace, data processing, and high-performance computing solutions.

By delivering high functionality and flexibility without compromising on power efficiency, the XC7K410T-3FFG676E stands as a critical component for developers looking to harness the advanced capabilities of FPGA technology in their projects.