Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC7K410T-2FBG676C, produced by AMD, is a high-caliber Field-Programmable Gate Array (FPGA) that situates itself prominently within the Kintex®-7 series, recognized for its exceptional performance and efficiency in processing. This device is packaged meticulously in a 676-BBGA, FCBG package, tailored for surface mount applications, ensuring a reliable and robust integration into various platforms.
With an operating temperature range from 0°C to 85°C, this FPGA is engineered to maintain its operational integrity under a broad spectrum of thermal conditions, making it a versatile choice for demanding environments. It boasts an impressive configuration of 406,720 logic elements or cells, which forms the foundation of its computational and processing capabilities. Alongside, it contains 31,775 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), facilitating intricate and complex logic circuit designs.
The XC7K410T-2FBG676C is equipped with a substantial memory capacity, featuring a total of 29,306,880 RAM bits, thereby offering ample storage for high-throughput applications. It also includes 400 I/O pins, providing extensive connectivity options and interfaces for peripheral devices.
This active-status component’s architecture is optimized for a range of applications in industries where high-speed data processing and operations are critical, including telecommunications, automotive, data processing, and defense. Its robustness, coupled with the FPGA’s flexibility in programming, makes it a go-to solution for developers looking to deploy high-performance logic operations within their systems.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 676-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 0.97V ~ 1.03V |
Number of Logic Elements/Cells | 406720 |
Supplier Device Package | 676-FCBGA (27x27) |
Number of LABs/CLBs | 31775 |
Total RAM Bits | 29306880 |
Part Status | Active |
Number of I/O | 400 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 322 I/O 484FBGA
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
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