The XC7K410T-1FFG900I, hailing from AMD’s elite collection, represents a pinnacle in the FPGA (Field-Programmable Gate Array) category, specially inaugurated under the renowned Kintex®-7 series. This component, meticulously housed in a 900-BBGA, FCBGA package, is designed for surface mount technology, ensuring seamless integration into a wide array of sophisticated circuit designs. Operating across a vast temperature spectrum from -40°C to 100°C (TJ), it guarantees unparalleled performance in the most demanding environments.

Notably, this FPGA is characterized by an impressive array of technical specifications:
– A substantial count of 406,720 logic elements/cells empowering developers to tackle complex computational tasks.
– A total of 31,775 LABs/CLBs providing the necessary logic blocks for versatile and efficient programming.
– A staggering 29,306,880 total RAM bits ensuring ample storage capacity for high-bandwidth applications.
– Robust I/O capabilities with up to 500 inputs/outputs, offering immense flexibility in peripheral and device connectivity.

These attributes make the XC7K410T-1FFG900I an indispensable asset across multiple industries, including telecommunications, automotive, defense, and high-performance computing, where reliability, efficiency, and scalability are paramount.

Key Features:
– Type: FPGA
– Series: Kintex®-7
– Packaging: Tray
– Package / Case: 900-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature Range: -40°C ~ 100°C (TJ)
– Logic Elements/Cells: 406,720
– LABs/CLBs: 31,775
– Total RAM Bits: 29,306,880
– Number of I/O: 500
– Part Status: Active
– Supplier Device Package: 900-FCBGA (31×31)

AMD’s commitment to innovation is further exemplified in the XC7K410T-1FFG900I, a powerful FPGA that seamlessly blends high-capacity processing with robust versatility, catering to the evolving needs of modern electronics.