The XC7K325T-L2FFG900E, part of the reputable Kintex®-7 series from AMD, stands out in the field of FPGAs with its high-performance capabilities and cutting-edge technology. This device is encapsulated in a 900-BBGA, FCBGA package, optimized for surface mount technology, ensuring a robust and reliable integration into a wide range of applications. With an operating temperature range of 0°C to 100°C (TJ), it offers a flexible solution for environments demanding high thermal stability.

This FPGA is equipped with 326,080 Logic Elements/Cells and 25,475 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), catering to complex digital computations and enabling versatile design implementations. The component is distinguished by its extensive Total RAM Bits of 16,404,480, providing substantial memory resources for data-intensive operations. Additionally, it supports up to 500 I/O pins, offering exceptional connectivity options for interfacing with other components and systems.

Packaged in a 900-FCBGA (31×31) form, the XC7K325T-L2FFG900E ensures a compact yet potent design solution, allowing for a high degree of integration in electronic assemblies. This FPGA is currently active and widely utilized in various industries, including telecommunications, automotive, consumer electronics, and aerospace, for its reliability, performance, and adaptability in addressing sophisticated digital processing needs.

The XC7K325T-L2FFG900E represents AMD’s commitment to delivering high-quality, cutting-edge products that address the complex requirements of modern digital electronics, making it an ideal choice for professionals seeking advanced FPGA solutions.