Explore the AMD XC7K160T-2FFG676I FPGA, a pivotal component under the Kintex®-7 Series, tailored for robust performance in a wide array of digital processing applications. This Field-Programmable Gate Array is housed in a 676-FCBGA (Field-Configurable Ball Grid Array) package, ensuring a compact footprint while providing ample I/O capabilities with 400 I/O pins. This surface-mount device is designed to operate within a broad temperature spectrum, from -40°C to 100°C, catering to environments demanding high reliability and stability.

The XC7K160T-2FFG676I is embedded with an impressive array of features:
– 162,240 Logic Elements/Cells and 12,675 Logic Array Blocks/Configurable Logic Blocks for versatile and complex digital circuit designs.
– A substantial memory capacity with 11,980,800 Total RAM Bits, supporting intricate data processing and storage needs.
– It comes in a tray packaging, ensuring safe and secure handling during shipping and assembly processes.

Industries such as telecommunications, automotive, data processing, and aerospace greatly benefit from the XC7K160T-2FFG676I’s capabilities, where high-speed, reliable data processing and storage are paramount. This FPGA stands out with its balance of high performance, flexibility, and integration, making it a go-to solution for engineering professionals looking to push the boundaries of digital computation and signal processing.

– Package / Case: 676-BBGA, FCBGA
– Mounting Type: Surface Mount
– Operating Temperature: -40°C ~ 100°C (TJ)
– Logic Elements/Cells: 162240
– LABs/CLBs: 12675
– Total RAM Bits: 11,980,800
– Number of I/O: 400
– Supplier Device Package: 676-FCBGA (27×27)
– Part Status: Active

This comprehensive description offers an in-depth overview of the AMD XC7K160T-2FFG676I’s technical specifications and potential industrial applications, making it an indispensable FPGA for innovative solutions requiring high-speed data processing and advanced logic capabilities.