The XC7K160T-1FBG676I, a high-performance FPGA from AMD’s renowned Kintex®-7 Series, stands out with its advanced technological specifications designed to meet the complex requirements of today’s high-speed digital processing applications. This component, housed in a 676-BBGA, FCBGA package, offers a robust solution for surface-mount technology applications, ensuring a reliable and durable integration into a wide range of electronic systems.

With an operating temperature range extending from -40°C to 100°C, this FPGA guarantees reliable performance under extreme environmental conditions, making it an ideal choice for industries that demand high reliability, including aerospace, defense, telecommunications, and industrial automation.

Featuring 162,240 logic elements/cells and 12,675 configurable logic blocks (LABs/CLBs), the XC7K160T-1FBG676I provides a flexible and scalable architecture for complex digital circuit designs. Its substantial offering of 11,980,800 total RAM bits enhances the device’s capacity for handling extensive data processing tasks, thereby facilitating the development of high-performance computational solutions.

This FPGA also features a staggering number of I/O pins, totaling 400, which enables extensive connectivity options for peripheral devices, further expanding its application potential. Packaged in a 676-FCBGA (27×27), this product underscores its suitability for projects where space optimization and high-density integration are critical.

As an active component within AMD’s product lineup, the XC7K160T-1FBG676I remains a go-to solution for developers and engineers looking for a reliable and highly capable FPGA to power their next-generation electronic systems.