The XC7K160T-1FBG676C is a high-performance FPGA part of the Kintex®-7 Series from AMD, designed to meet the advanced needs of a wide array of applications including telecommunications, automotive, and industrial control systems. This device is housed in a 676-ball fine-pitch ball grid array (FCBGA) package, enabling efficient surface mount integration onto PCBs.

With an impressive array of 162,240 logic elements and 12,675 logic array blocks (LABs)/configurable logic blocks (CLBs), this FPGA is engineered for complex digital processing tasks. It features 11,980,800 total RAM bits, providing ample space for high-speed data storage and manipulation. The large number of I/O pins, totaling 400, ensures versatile connectivity options for diverse system requirements.

Operating within a temperature range from 0°C to 85°C (TJ), the XC7K160T-1FBG676C is suitable for deployment in environments that demand reliable performance under varying thermal conditions. The device is currently in active production status, indicating its availability and ongoing manufacturer support.

This FPGA is presented in a tray packaging, indicating its readiness for bulk handling and production assembly processes. Its sophisticated architecture and robust feature set make the XC7K160T-1FBG676C a preferred choice for developers and engineers looking to leverage high-end FPGA technology for sophisticated digital designs.