The XC7A200T-1FBG676I, a high-performing FPGA from the Artix-7 Series by AMD, underscores an advanced technological architecture specifically designed for seamless integration and superior functionality in complex applications. This component is encapsulated in a 676-BBGA, FCBGA package, optimized for surface mount technology, making it a quintessential choice for designs where space and performance are critical.

Luxuriating in a robust operating temperature range of -40°C to 100°C, this FPGA is suited for environments demanding steadfast reliability. The device boasts an impressive logic capacity, featuring over 215,360 logic elements/cells and 16,825 LABs/CLBs, which facilitates the development of highly intricate digital circuits with reduced footprints and increased efficiency.

Moreover, with a total of 13,455,360 RAM bits, it provides vast memory resources for high-speed data processing and storage, aiding tremendously in applications requiring rapid data access and manipulation. The XC7A200T-1FBG676I also supports up to 400 I/O ports, offering unparalleled connectivity options for interfacing with a multitude of peripheral devices.

Packaged in a 676-FCBGA (27×27), this FPGA’s active status indicates ongoing manufacturer support and availability, ensuring long-term utility and compatibility for future designs. Predominantly utilized in industries that push the envelope in technological advancements such as telecommunications, aerospace, defense, and high-performance computing, this component sets the standard for reliability, scalability, and performance.

With these characteristics, the XC7A200T-1FBG676I suits applications that demand high-speed data processing, intricate logic implementations, and extensive I/O interfacing, making it a cornerstone in the development of next-generation electronic systems.