The XC7A200T-1FB676I, crafted by AMD, represents a state-of-the-art FPGA within the renowned Artix-7 series, optimized for high-performance applications across a variety of industries including telecommunications, automotive, and data processing, where rapid data handling and processing are paramount. This component, housed in a durable 676-BBGA, FCBGA package, is designed for surface mount applications and ensures reliable operation in extreme conditions with an operating temperature range of -40°C to 100°C.

With a substantial number of logic elements/cells, totaling 215,360, and 16,825 LABs/CLBs, this FPGA is engineered for the most demanding tasks, offering unmatched flexibility and capacity for complex digital circuits. The XC7A200T-1FB676I also boasts an impressive 13,455,360 total RAM bits, facilitating efficient handling of data-intensive operations. Additionally, this component supports a vast array of I/O options with 400 available I/Os, providing ample connectivity for peripherals and external devices.

Packaged in a 676-FCBGA with dimensions of 27×27, the XC7A200T-1FB676I ensures a compact footprint while maintaining high performance and reliability. It remains in active production, indicating ongoing support and availability for comprehensive system designs and future expansions.

This FPGA embodies a critical solution for designers and engineers seeking to harness the full potential of their digital systems, delivering superior performance, versatility, and reliability in challenging and dynamic technological environments.