The XC6SLX9-2CSG225I, crafted by AMD, stands as a pivotal FPGA component within the Spartan®-6 LX series, undergoing packaging in a tray format. This FPGA is encased in a 225-LFBGA, CSPBGA package, optimized for surface mount techniques, ensuring seamless integration into a wide array of electronic assemblies. Its architecture is defined by 9,152 logic elements/cells and 715 LABs/CLBs, backed by a substantial 589,824 total RAM bits, positioning this device as a formidable choice for complex digital processing tasks.

With an expansive suite of 160 I/O pins, the XC6SLX9-2CSG225I offers ample connectivity for a broad spectrum of applications, ranging from high-speed digital signal processing to advanced control systems. This flexibility is further enhanced by its operational temperature range, spanning from -40°C to 100°C (TJ), which ensures reliability in diverse environmental conditions.

Encased in a 225-CSPBGA (13×13) supplier device package, this FPGA is poised for deployment in industries where precision and efficiency are paramount. The Spartan®-6 LX series is heralded for its ability to deliver high-performance, low-cost programmable logic solutions, making the XC6SLX9-2CSG225I an ideal choice for applications in telecommunications, automotive, consumer electronics, and aerospace sectors, among others.

With its status as an active component under the AMD portfolio, the XC6SLX9-2CSG225I represents a synthesis of advanced technological innovation and application versatility, tailored for sophisticated designs that demand high levels of customization and reliability.