The XC6SLX75T-N3FGG484I, crafted by AMD, stands as a high-performance FPGA under the reputable Spartan®-6 LXT series, tailored for advanced digital processing tasks. This component is encapsulated within a 484-BBGA package, optimized for surface mount technology, ensuring a seamless fit into compact and complex PCB designs. With its impressive array of 74,637 logic elements/cells and 5,831 LABs/CLBs, this FPGA is engineered to address the demanding requirements of high-throughput computing and signal processing applications.

Operating robustly across a wide temperature range from -40°C to 100°C, the XC6SLX75T-N3FGG484I guarantees reliability in harsh environmental conditions, making it an ideal choice for industries that operate under extreme temperatures. This flexibility in operation ensures that the component can seamlessly integrate into systems within automotive, industrial automation, telecommunications, and defense sectors, where reliability and endurance are paramount.

The device boasts a substantial memory capacity with 3,170,304 total RAM bits, facilitating the handling of complex data algorithms and high-speed signal processing with pronounced efficiency. Additionally, with 268 configurable I/O ports, this FPGA allows for a versatile interface with other components in a system, enhancing its adaptability to varied application requirements. Packaged in a 484-FBGA (23×23) form factor, the XC6SLX75T-N3FGG484I maintains a balance between compactness and functionality, proving its worth as a pivotal component in the development of sophisticated digital systems.