The XC6SLX75-2FGG676C, crafted by AMD, stands as a prominent product in the FPGA sector, specifically aligned with the Spartan®-6 LX series. This component is encapsulated in a 676-BGA package, designed for surface mount technology, ensuring a robust and reliable connection to printed circuit boards. The FPGA operates effectively within a temperature range of 0°C to 85°C (TJ), making it suitable for a variety of operating environments.

With a remarkable configuration of 74,637 logic elements/cells and 5,831 LABs/CLBs, this FPGA is engineered to support complex digital circuits, offering a vast landscape for design flexibility and innovation. It further integrates a substantial total of 3,170,304 RAM bits, enabling significant data storage and manipulation capabilities. The device encompasses 408 I/O pins, facilitating extensive connectivity options and interfacing capabilities.

Packaged in a 676-FBGA (27×27) format, the XC6SLX75-2FGG676C maintains an active part status, indicating its continued production and support from AMD. This FPGA is pivotal in advancing projects within industries that demand high-performance computing and are reliant on intricate digital processing—such as telecommunications, automotive, defense, and consumer electronics—demonstrating its versatility and capability to drive technological progress. Its comprehensive feature set and robust performance metrics render it an essential component for engineers seeking advanced solutions in complex systems integration.