The XC6SLX45-3FGG676C, a high-performance FPGA from AMD’s renowned Spartan®-6 LX series, stands out as a critical component for advanced project development in a wide array of industries, including telecommunications, automotive, and consumer electronics. Housed in a 676-BGA package, it offers a compact yet robust solution for demanding applications.

Tailored for surface mount technology, this FPGA boasts an impressive array of features including 43,661 logic elements/cells and 3,411 logic array blocks/CLBs, making it highly versatile for complex digital processing tasks. It supports a wide operating temperature range from 0°C to 85°C (TJ), ensuring reliability under varied environmental conditions.

With a significant total RAM Bits count of 2,138,112 and 358 available I/O ports, the XC6SLX45-3FGG676C accommodates extensive data storage and high-speed connectivity, respectively. Such attributes make it ideally suited for high-density designs requiring meticulous control and rapid data transfer.

Its packaging in trays facilitates efficient handling and integration into manufacturing pipelines, emphasizing its role in high-volume production environments. The FPGA’s supplier device package is specified as 676-FBGA (27×27), indicating its compact footprint despite the immense capability.

Currently active in AMD’s product line, this Spartan®-6 LX series FPGA remains a go-to solution for designers seeking a balance between performance, power efficiency, and cost-effectiveness. The XC6SLX45-3FGG676C embodies AMD’s commitment to delivering cutting-edge technology for complex digital challenges across multiple sectors.