Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX25-3FT256I, a pivotal FPGA from AMD’s renowned Spartan®-6 LX series, stands as a cutting-edge solution tailored for sophisticated programming and design requirements in surface mount technology. Fabricated with a 256-LBGA package, this component ensures a secure and reliable attachment to printed circuit boards, catering to the industry’s increasing demand for compact yet powerful devices.
With an operating temperature range of -40°C to 100°C, the XC6SLX25-3FT256I is designed to perform reliably in a diverse array of operational environments, making it an ideal choice for applications requiring extended temperature ranges. The device boasts a substantial configuration of 24,051 logic elements/cells, providing ample flexibility for complex digital circuits and systems.
Structured around 1,879 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs) and equipped with 958,464 total RAM bits, this FPGA offers a robust platform for developing high-performance, memory-intensive applications. The presence of 186 I/O ports further enhances its versatility, enabling extensive connectivity options for a wide range of electronic components and systems.
The XC6SLX25-3FT256I addresses the critical needs across various industries, including telecommunications, automotive, consumer electronics, and aerospace, wherein reliability, adaptability, and power efficiency are paramount. Its active part status confirms ongoing manufacturer support and availability, ensuring long-term applicability and consistency in supply for industrial projects and innovations.
As part of the Spartan®-6 LX series, this FPGA is a testament to AMD’s commitment to delivering high-quality, programmable logic solutions that push the boundaries of digital design and integrated circuit technology.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-LBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 24051 |
Supplier Device Package | 256-FTBGA (17x17) |
Number of LABs/CLBs | 1879 |
Total RAM Bits | 958464 |
Part Status | Active |
Number of I/O | 186 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 341 I/O 484FBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA ARTIXUP 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 83 I/O 100QFP
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 315 I/O 484FBGA
IC FPGA 150 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
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