The XC6SLX150-3FGG676I, crafted by AMD, stands as a prominent figure in the Spartan®-6 LX series, catering to a wide array of FPGA applications. This component encapsulates a robust architecture with 147,443 logic elements/cells and 11,519 LABs/CLBs, offering an expansive foundation for developing complex digital circuits and systems. Enclosed in a 676-BGA package and designed for surface mount applications, it ensures a secure and reliable integration into a multitude of product environments.

Operating within a temperature range of -40°C to 100°C, this FPGA is engineered for resilience in varying environmental conditions, making it an ideal choice for industrial, automotive, and consumer electronics that demand high reliability and performance under stress. With a total of 498 versatile I/Os and a massive 4,939,776 total RAM bits, the XC6SLX150-3FGG676I offers extensive interfacing and data storage capabilities, catering to high-performance computing tasks and complex digital processing requirements.

The 676-FBGA (27×27) supplier device package not only eases the integration process but also contributes to efficient thermal management and compact footprint design, accommodating the demanding space constraints of today’s sophisticated electronic assemblies.

Continuing to hold an active part status, the XC6SLX150-3FGG676I remains a vital component for developers and engineers seeking to harness the power of advanced FPGA technology for leading-edge projects and innovations within the technology sector.