The XC6SLX150-3FGG676C, a high-performance FPGA from AMD’s renowned Spartan®-6 LX series, offers a robust solution for demanding applications requiring a blend of power efficiency and processing capability. This device is encapsulated in a 676-BGA package and designed for surface mount applications, ensuring a compact footprint ideal for high-density designs. With an operating temperature range of 0°C to 85°C, it provides reliability across various environments.

Boasting 147,443 logic elements/cells and accommodating 11,519 logic array blocks (LABs)/configurable logic blocks (CLBs), the XC6SLX150-3FGG676C delivers the flexibility and scalability needed for complex digital logic circuits. Its substantial onboard memory, totaling 4,939,776 RAM bits, supports extensive data storage and manipulation capabilities crucial for data-intensive operations.

Additionally, this FPGA offers 498 I/O pins, facilitating extensive connectivity options for interfacing with other components within a system architecture. Its active status highlights its ongoing relevance and availability in current market scenarios.

This component is a staple in applications across various industries, including telecommunications, automotive, industrial control systems, and consumer electronics, due to its versatile nature and reliable performance under a range of operational conditions. The Spartan®-6 LX series is lauded for delivering cost-effective solutions without compromising on the capabilities essential for today’s innovative technological solutions.