The XC6SLX150-2FGG900I, manufactured by AMD, falls under the category of FPGAs and is a prominent component of the Spartan®-6 LX series. Encased in a 900-BBGA packaging, it provides a highly durable surface mount solution tailored for rigorous environments, boasting an operational temperature range from -40°C to 100°C (TJ). This FPGA stands out with its substantial configuration, comprising 147,443 logic elements/cells and 11,519 LABs/CLBs which facilitate complex digital computations and signal processing tasks efficiently.

Its architecture is designed to support a wide array of applications thanks to its extensive I/O capability of 576, making it highly versatile for various interfacing requirements. With a total of 4,939,776 RAM bits, the XC6SLX150-2FGG900I offers ample storage for user applications, ensuring smooth and robust data management and processing capabilities. Encapsulated in a 900-FBGA (31×31) supplier device package, this FPGA ensures a compact form factor without compromising on its expansive feature set.

Primarily utilized across industries like telecommunications, automotive, defense, and consumer electronics, the Spartan®-6 LX series is renowned for its reliability and efficiency in handling high-performance computing tasks. The XC6SLX150-2FGG900I, with its significant logic resources and adaptive logic modules, stands as a critical component for designers looking to push the boundaries of what’s possible within their digital designs, engineering solutions that are both innovative and forward-thinking.