The XC6SLX100T-2FGG676I, crafted by AMD, stands as a pivotal component within the FPGA category belonging to the esteemed Spartan®-6 LXT series. This advanced FPGA is meticulously packaged into a 676-BGA format to accommodate surface mount technology, which suits a broad spectrum of high-reliability applications. Engineered for robust performance, it operates efficiently in a wide temperature range from -40°C to 100°C (TJ), ensuring unwavering reliability across various environments.

Key features of the XC6SLX100T-2FGG676I include:

– Advanced FPGA technology fromAMD’s Spartan®-6 LXT series.
– Robust surface mount 676-BGA package ensuring durability and reliability.
– High logic density with 101,261 Logic Elements/Cells and 7,911 LABs/CLBs.
– Expansive memory capabilities with a total of 4,939,776 RAM bits.
– Extensive I/O capabilities with 376 available for versatile connectivity.
– Operational temperature resilience from -40°C to 100°C (TJ), catering to demanding environments.
– Packaged in a tray format with a supplier device package of 676-FBGA (27×27).

This FPGA is ideally suited for applications requiring high levels of processing power and speed across various industries, including telecommunications, automotive, defense, and consumer electronics, due to its extensive logic and memory capacity combined with a high number of I/O ports. The Spartan®-6 LXT series is designed to meet the rigorous demands of modern circuit designs, ensuring that the XC6SLX100T-2FGG676I delivers exceptional performance and flexibility for sophisticated electronic system architectures.