Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX100-3FGG484I is a high-performance FPGA from AMD’s prestigious Spartan®-6 LX series, renowned for its exceptional logic and memory integration capabilities. This component encapsulates advanced technology in a 484-BBGA package, tailored for surface mount applications, ensuring robust performance across diverse environmental conditions with an operating temperature range of -40°C to 100°C (TJ).
Designed with a staggering 101,261 logic elements/cells and 7,911 LABs/CLBs, it provides the flexibility and capacity needed for complex digital processing tasks. The FPGA stands out with its substantial built-in storage, offering 4,939,776 total RAM bits, making it an ideal choice for data-intensive applications. Accommodating a wide array of designs, the XC6SLX100-3FGG484I features 326 I/O ports, enhancing connectivity and interfacing capabilities with other components in a system.
Encapsulated in a 484-FBGA (23×23) package, the device is optimized for streamlined integration into a multitude of projects requiring high-density logic solutions. Its active part status underscores ongoing support and availability, ensuring reliability for both new designs and existing systems needing upgrades or maintenance.
Broadly applicable across a variety of industries, including telecommunications, automotive, consumer electronics, and aerospace, the XC6SLX100-3FGG484I provides a versatile foundation for developing state-of-the-art digital circuits. Whether powering sophisticated communication systems, enhancing automotive control units, or driving innovation in consumer electronics, this FPGA delivers unmatched performance and reliability.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 101261 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 7911 |
Total RAM Bits | 4939776 |
Part Status | Active |
Number of I/O | 326 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
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