Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX100-2FGG676C FPGA, part of AMD’s renowned Spartan®-6 LX series, stands out as a leading component in the field of programmable logic devices. This device is encapsulated in a 676-BGA package and designed for surface mount applications, ensuring a secure and reliable integration into a multitude of electronic assemblies. With an operating temperature range from 0°C to 85°C, it is versatile for use in various environmental conditions.
This FPGA is equipped with an impressive 101,261 logic elements/cells, highlighting its capacity to handle complex digital computations and signal processing tasks efficiently. The Spartan®-6 LX series is known for its high performance and low-power consumption, making the XC6SLX100-2FGG676C an ideal choice for power-sensitive applications.
Furthermore, the device features 7,911 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs) and boasts a total RAM of 4,939,776 bits, providing ample storage and flexibility for intricate designs and applications. With 480 I/O pins, it offers extensive connectivity options, supporting a wide range of peripherals and interfaces.
The XC6SLX100-2FGG676C FPGA is currently in an active part status and available in a tray packaging format. Its advanced features and specifications make it suitable for a wide array of industries, including telecommunications, automotive, consumer electronics, and aerospace, where high-speed data processing and system reliability are paramount. This device embodies AMD’s commitment to delivering high-quality and cutting-edge technology solutions for complex digital systems.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 676-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 101261 |
Supplier Device Package | 676-FBGA (27x27) |
Number of LABs/CLBs | 7911 |
Total RAM Bits | 4939776 |
Part Status | Active |
Number of I/O | 480 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 475 I/O 672FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
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