The XC5VSX35T-2FFG665I, manufactured by AMD, represents a pinnacle in the FPGA category, under the esteemed Virtex®-5 SXT series. Encapsulated in a 665-BBGA, FCBGA package, this component is designed to meet the exigent demands of advanced surface mount technologies, ensuring seamless integration into various application environments.

This FPGA boasts an operational temperature range of -40°C to 100°C (TJ), offering a robust solution for applications that are subjected to extreme conditions. Its architecture comprises 34,816 logic elements/cells, and 2,720 LABs/CLBs, making it a powerhouse for complex, high-performance computing tasks.

With a total RAM Bits of 3,096,576, the XC5VSX35T-2FFG665I provides expansive data storage capabilities, facilitating efficient data processing and manipulation across a broad spectrum of applications. Moreover, its provision of 360 I/O ports underscores its versatility in interfacing with other devices within a system, enhancing its utility in multi-faceted electronic designs.

Packaged in a 665-FCBGA (27×27), this FPGA is primed for high-density board layouts, affirming its suitability for leading-edge projects requiring the highest standards of miniaturization and performance.

The active status of the XC5VSX35T-2FFG665I indicates its ongoing relevance and availability for cutting-edge applications, ranging from data processing, telecommunications, to sophisticated defense and aerospace projects, underscoring its importance in the forefront of technological innovation and application.