The XC5VLX30-1FFG676C, crafted by AMD, stands as a cutting-edge FPGA from the distinguished Virtex®-5 LX series. This component encapsulates high-end features in a 676-BBGA, FCBGA package, optimized for surface mount technology, ensuring a seamless integration into a multitude of PCB designs. Its robustness is highlighted by its operational temperature range of 0°C to 85°C (TJ), catering to a wide spectrum of environmental conditions.

Boasting an impressive configuration of 30,720 logic elements and cells, complemented by 2,400 LABs/CLBs, this FPGA is engineered to deliver exceptional performance and flexibility. The inclusion of 1,179,648 total RAM bits further enhances its capacity to handle complex data processing and storage requirements with ease.

Equipped with 400 I/O pins, the XC5VLX30-1FFG676C provides extensive connectivity options, facilitating versatile interactions with other components in sophisticated systems. Its packaging in a tray format, along with a supplier device package of 676-FCBGA (27×27), underlines its premium quality and readiness for deployment in high-grade applications.

Such advanced specifications make the XC5VLX30-1FFG676C an ideal choice for professionals seeking to empower projects across various industries, including telecommunications, defense, and aerospace, where the demand for high-performance computing resources and reliable data processing capabilities are paramount.

Currently listed as active, this FPGA represents AMD’s commitment to delivering state-of-the-art solutions that meet the evolving needs of technology sectors, emphasizing the blend of performance, efficiency, and versatility inherent in the Virtex®-5 LX series.