Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC5VLX30-1FF676C, crafted by AMD, is a cutting-edge FPGA within the Virtex®-5 LX series, known for its robust design and high-performance capabilities. This component is encapsulated in a 676-BBGA, FCBGA package, optimized for surface mount technology, ensuring seamless integration into a wide variety of applications. Suitable for operation in environments with temperatures ranging from 0°C to 85°C (TJ), it offers great versatility under different operating conditions.
This particular FPGA boasts 30,720 logic elements/cells and 2,400 LABs/CLBs, making it a potent choice for complex digital computations and signal processing tasks. With a substantial amount of on-chip storage, totaling 1,179,648 RAM bits, this component can handle data-intensive operations efficiently. The XC5VLX30-1FF676C provides an impressive array of 400 I/O ports, facilitating extensive connectivity and interface options for a broad array of applications.
Packaged in a 676-FCBGA (27×27) form factor, it adheres to stringent industry standards for quality and reliability. Currently holding an active part status, this FPGA is a reliable choice for developers focusing on telecommunications, automotive, aerospace, and defense industries, where performance and durability are critical.
This Virtex®-5 LX series FPGA represents AMD’s commitment to delivering high-grade solutions for advanced electronic systems, offering the perfect balance between power, performance, and flexibility. Its comprehensive feature set ensures it meets the rigorous demands of professionalgrade, high-complexity integrated circuit design and deployment.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 676-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 0.95V ~ 1.05V |
Number of Logic Elements/Cells | 30720 |
Supplier Device Package | 676-FCBGA (27x27) |
Number of LABs/CLBs | 2400 |
Total RAM Bits | 1179648 |
Part Status | Active |
Number of I/O | 400 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 83 I/O 100QFP
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
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