Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC5VFX200T-2FF1738C is a high-capacity Field-Programmable Gate Array (FPGA) designed by AMD, specifically part of the advanced Virtex®-5 FXT series. These FPGAs are well-regarded for their robust performance and are deployed across a diverse set of industries including telecommunications, automotive, defense, and aerospace sectors where reliability and high-speed data processing are critical.
Featuring an impressive array of technical specifications, this component is housed in a 1738-Ball Fine-Pitch Ball Grid Array (FBGA) package, optimizing it for surface mount technology. The FPGA operates efficiently within a temperature range of 0°C to 85°C (TJ), ensuring reliability across various environmental conditions.
Key Specifications:
– Packaging in Tray form for secure handling and storage.
– The FPGA is encased in a 1738-BBGA, FCBGA package for enhanced performance and thermal management.
– Surface Mount mounting type for streamlined PCB design processes.
– Boasts a substantial number of Logic Elements/Cells totaling 196,608, providing vast logical processing capabilities.
– Equipped with 15,360 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs) for flexible and complex logic operations.
– Offers an extensive total RAM Bits of 16,809,984, ensuring ample memory capacity for demanding applications.
– Maintains Active part status, signaling ongoing manufacturer support and availability.
– Includes 960 Input/Output (I/O) ports, facilitating extensive connectivity options for various peripheral devices.
The XC5VFX200T-2FF1738C by AMD is engineered to meet the demanding requirements of applications requiring high-speed data manipulation and processing, making it an indispensable component in the development of cutting-edge technology solutions.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 1738-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 0.95V ~ 1.05V |
Number of Logic Elements/Cells | 196608 |
Supplier Device Package | 1738-FCBGA (42.5x42.5) |
Number of LABs/CLBs | 15360 |
Total RAM Bits | 16809984 |
Part Status | Active |
Number of I/O | 960 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA ARTIXUP 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 322 I/O 484FBGA
IC FPGA 83 I/O 100QFP
IC FPGA 387 I/O 676FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 81 I/O 100TQFP
IC FPGA 226 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |