The XC5VFX130T-1FFG1738C, crafted by AMD, epitomizes the pinnacle of FPGA technology under the celebrated Virtex®-5 FXT series. Encased in a robust 1738-BBGA, FCBGA package, this component embraces surface mount technology, ensuring a seamless integration with a plethora of modern PCB designs. Operating within a thermal junction range of 0°C to 85°C, it guarantees reliability across various temperature conditions.

This device is distinguished by its impressive array of 131,072 logic elements/cells, backed by 10,240 LABs/CLBs, making it an ideal choice for complex digital processing tasks. With a substantial total RAM bits of 10,985,472, it offers ample space for data storage and manipulation, crucial for high-demand applications. Furthermore, the XC5VFX130T-1FFG1738C boasts an extensive 840 I/O ports, facilitating versatile connectivity options for diverse external interfaces.

Its 1738-FCBGA (42.5×42.5) supplier device package not only underscores its advanced design but also its capability to handle dense circuit configurations. Currently marked as active, this FPGA finds its utility in a multitude of industries including telecommunications, automotive, defence, and aerospace sectors, where its performance and flexibility are highly valued.

The XC5VFX130T-1FFG1738C stands as a testament to AMD’s commitment to delivering cutting-edge solutions that meet the intricate demands of today’s digital environment, making it a quintessential component for design engineers and technology innovators looking to leverage unmatched computational power and versatility.