The Intel EPF8820ATC144-3, part of the highly regarded FLEX 8000 series, is an FPGA (Field-Programmable Gate Array) offering a robust solution for complex digital circuit design. This part is encapsulated in a 144-LQFP (Low Profile Quad Flat Package) and designed for surface mount technology, ensuring a secure fit on today’s densely populated circuit boards.

With an operating temperature range of 0°C to 70°C, this FPGA is suitable for a wide variety of applications across different industries, including telecommunications, automotive systems, and consumer electronics. It boasts 672 logic elements/cells and 84 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), providing a flexible platform for implementing multi-function logic on a single chip. These features make it an excellent choice for designers looking to integrate a high density of logic into their projects.

Furthermore, the EPF8820ATC144-3 supports up to 112 I/O pins, allowing for extensive interfacing with other components within the system. Despite its status as an obsolete product, its advanced logic capability and adaptability in design applications continue to make it a valuable component for developing sophisticated electronic systems.

Packaged in a 144-TQFP form factor measuring 20x20mm, it provides a compact, yet powerful, solution for FPGA design requirements. Its surface-mount package type is crucial for modern, high-speed electronic assemblies, emphasizing its utility in creating efficient, high-performance hardware.