The EPF8282ATI100-3N, crafted by Intel, falls under the category of Field Programmable Gate Arrays (FPGAs) from the renowned FLEX 8000 series. It is presented in a 100-TQFP (Thin Quad Flat Pack) package, ensuring a secure and reliable surface-mount application. Designed to endure challenging conditions, this component operates over a temperature range of -40°C to 85°C (TA), making it suitable for a wide range of industrial applications.

With 208 logic elements/cells and 26 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA offers a flexible and efficient solution for the custom logic design needs of advanced projects. The device provides 78 input/output (I/O) ports, giving engineers ample connectivity options to interface with peripherals and other components within complex systems.

Housed in a tray packaging format, the EPF8282ATI100-3N facilitates streamlined handling and integration during the manufacturing process. Despite its status as an obsolete part, it remains a sought-after component for specific applications in sectors requiring high reliability and programmability within a compact footprint.

The Intel EPF8282ATI100-3N encapsulates a balance of performance and versatility, solidifying its place in designs that demand a rigorous yet flexible digital logic solution. Its legacy in applications that have historically leveraged the FLEX 8000 series technology underlines the enduring value such components bring to sophisticated electronic systems.