The EPF81188AQC240-3, crafted by Intel, stands as a prominent figure within the FPGAs category under the esteemed FLEX 8000 series. This field-programmable gate array is housed in a 240-BFQFP package, optimized for surface mount technologies, making it an ideal choice for streamlined manufacturing processes. It operates within a temperature range of 0°C to 70°C (TA), ensuring reliability across varying environmental conditions. This device is offered in a 240-PQFP (32×32) package, meticulously designed to support complex designs with its substantial I/O capabilities, boasting 184 input/output options.

With a configuration of 126 logic array blocks (LABs)/configurable logic blocks (CLBs), this FPGA is engineered to cater to intricate digital logic designs. The EPF81188AQC240-3 maintains its status as an active component, indicative of its ongoing relevance and availability in contemporary and future applications. This versatility makes it a prime choice across a diverse range of industries, including but not limited to telecommunications, consumer electronics, automotive systems, and aerospace technology, where the demand for high-performance, programmable solutions is ever-present.

Intel’s commitment to innovation is reflected in the EPF81188AQC240-3 FPGA, ensuring not just cutting-edge technology but also reliability and adaptability in meeting the sophisticated requirements of advanced electronic system designs.