The EPF6016TC144-2N is a high-performance FPGA from Intel’s acclaimed FLEX 6000 series, tailored for advanced applications across various industries, including telecommunications, automotive, and consumer electronics. Housed in a 144-LQFP package, this surface-mount device is designed for seamless integration into sophisticated circuit designs.

With an operating temperature range of 0°C to 85°C, it guarantees reliability under varying environmental conditions, making it ideal for deployment in systems requiring robust performance. The FPGA boasts 1320 logic elements/cells and 132 LABs/CLBs, offering a versatile and scalable architecture for complex digital circuit implementation. Furthermore, it is equipped with 117 I/O pins, providing extensive connectivity options to meet the demands of a wide array of applications.

This product comes in tray packaging, ensuring safe and secure handling during shipping and assembly processes. The 144-TQFP (20×20) supplier device package is carefully designed to optimize board space without compromising performance.

Although marked as obsolete, the EPF6016TC144-2N remains a sought-after component among professionals seeking to leverage Intel’s engineering excellence for projects requiring a balance of power and efficiency in FPGA design. Its legacy status underscores its proven track record in delivering exceptional performance for demanding digital processing tasks.