The EPF6016QC208-3 by Intel is a high-performing Field-Programmable Gate Array (FPGA) from the FLEX 6000 series, now categorized as obsolete. Encased in a 208-BFQFP (Bumpered Flat Quad Flat Package), this FPGA is optimized for surface mount technology, ensuring ease of integration into a variety of electronic assemblies. The device operates within a temperature range of 0°C to 85°C, accommodating various operating environments.

Featuring 1320 logic elements/cells and 132 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EPF6016QC208-3 is engineered to support the intricate digital logic designs required in advanced electronic systems. It presents a substantial number of I/O pins, totaling 171, which facilitates extensive connectivity options for complex circuit configurations.

Packaged in a 208-PQFP (28×28), the component offers a compact form factor while providing robust functionality and versatility in design. This FPGA has historically been integrated into a wide array of applications across diverse industries, including telecommunications, automotive, consumer electronics, and aerospace, thanks to its flexibility in programmability and performance adaptability.

It’s important to note that the obsolescence of the EPF6016QC208-3 suggests potential challenges in procurement for new designs but also underscores its valued presence in maintaining and updating existing systems that rely on this specific FPGA architecture.