The Intel EPF6016BC256-2 FPGA (Field-Programmable Gate Array) is a key component in the FLEX 6000 series, renowned for its reliability and adaptability across various applications. With obsolete part status, this specific FPGA offers a sophisticated solution designed to meet the rigorous demands of complex digital systems. Fabricated for surface mount technology and encapsulated in a 256-LBGA package, it ensures a compact footprint while providing robust performance.

Key technical features of the EPF6016BC256-2 include:

– Package / Case: 256-LBGA, enabling a compact design with efficient thermal management.
– Operating temperature range of 0°C to 85°C, ensuring reliable performance across a wide range of environmental conditions.
– A total of 1320 logic elements/cells, facilitating versatile digital logic configurations and complex function implementations.
– The component supports 132 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), enabling flexible and customizable logic partitioning for efficient algorithm execution.
– It boasts 204 input/output pins, offering extensive connectivity options for interfacing with other components within a system.
– The device is designed for surface mounting, allowing for denser circuit designs and reduced PCB space requirements.

Predominantly utilized in sophisticated digital circuit designs, the EPF6016BC256-2 finds its application across various industries including telecommunications, automotive systems, consumer electronics, and aerospace for its reliability and flexibility in handling complex logic operations. Its notable features, such as the vast number of logic elements and I/O capabilities, make it a preferred choice for engineers and designers looking to push the boundaries of technology in their respective fields.