The Intel EPF6016ATC144-3N from the FLEX 6000 series stands out as a highly-capable Field Programmable Gate Array (FPGA) designed to meet the demanding requirements of advanced digital systems. This component is encapsulated in a 144-LQFP package, tailored for surface mount techniques, facilitating ease of integration into a broad spectrum of applications. The device’s architecture includes 1320 logic elements/cells and 132 logic array blocks (LABs)/configurable logic blocks (CLBs), highlighting its robust computational and configurational capabilities.

Key Specifications:

– Manufacturer: Intel
– Series: FLEX 6000
– Part Number: EPF6016ATC144-3N
– Packaging: Tray, ensuring component safety during shipping and handling
– Package / Case: 144-LQFP, optimizing the balance between functionality and form factor
– Mounting Type: Surface Mount, for straightforward PCB assembly
– Operating Temperature Range: 0°C to 85°C, ensuring reliability across various environmental conditions
– Logic Elements/Cells: 1320, enabling complex logic functions
– LABs/CLBs: 132, allowing for flexible and efficient logic design
– Number of I/O: 117, providing ample connectivity options for peripheral devices
– Supplier Device Package: 144-TQFP (20×20), indicating the physical dimension and pin configuration
– Part Status: Obsolete, pointing towards limited availability but continued relevance in specific applications

Given its specifications, the EPF6016ATC144-3N is adept at supporting intricate designs in sectors such as telecommunications, consumer electronics, automotive systems, and industrial control units. Its ability to reconfigure logic circuits post-manufacture offers unparalleled flexibility in addressing evolving technological needs, embodying Intel’s commitment to innovation and excellence in the FPGA domain.