The EPF6010ATC100-1, crafted by Intel, stands as a sophisticated FPGA from the acclaimed FLEX 6000 series. This component is engineered to meet the advanced needs of a variety of applications with its robust functionality and flexible design capabilities. Packaged in a 100-TQFP (14×14) format, it offers a practical solution for systems where space and layout optimization are critical.

Designed for surface mount technology, it ensures a secure and efficient assembly process, aligning with the industry’s movement towards more compact and efficient designs. The EPF6010ATC100-1 operates within a temperature range of 0°C to 85°C (TJ), making it suitable for a broad spectrum of environments and confirming its reliability under varying operational stress.

With 880 logic elements/cells and 88 LABs/CLBs, this FPGA provides a solid foundation for creating complex digital circuits. This enables designers to achieve high levels of system integration and functionality, crucial for developing sophisticated electronic systems. Additionally, the device offers 71 I/O pins, allowing for flexible connectivity options with other components in the system.

The EPF6010ATC100-1 is currently categorized under an active part status, ensuring its availability and ongoing support for both new designs and existing projects that require a reliable FPGA solution. Its application spans across various industries, including telecommunications, automotive systems, consumer electronics, and more, demonstrating its versatility and adaptability to meet specific industry needs.

Intel’s commitment to providing advanced solutions is evident in the EPF6010ATC100-1, making it an essential component for projects requiring high-performance FPGA capabilities.