Introducing the EPF10K50VQC240-3N, a high-performance FPGA from Intel’s renowned FLEX-10K® series, designed for advanced applications requiring a flexible and powerful digital logic solution. This component comes encapsulated in a 240-BFQFP package, suitable for surface mount technologies, ensuring a seamless integration into various circuit designs.

With its robust architecture, the EPF10K50VQC240-3N is engineered to operate within a temperature range of 0°C to 70°C, making it an ideal choice for applications in demanding environments. This FPGA is equipped with 2,880 logic elements/cells, orchestrated in 360 LABs/CLBs, providing the flexibility and computational power needed for complex digital processing tasks. The device also boasts a significant amount of embedded RAM, totaling 20,480 bits, to support intensive data storage and manipulation requirements.

Additionally, the EPF10K50VQC240-3N offers a vast array of 189 I/O pins, allowing for extensive connectivity options with peripherals and other components within a system. Despite being categorized as obsolete, this part continues to be a critical asset in legacy systems across various industries due to its proven reliability and performance.

Key features of the EPF10K50VQC240-3N include:
– Packaged in a 240-BFQFP for efficient space utilization and compatibility with surface mount installations.
– Utilizes 2,880 logic elements/cells and 360 LABs/CLBs for superior logic implementation.
– Embedded with 20,480 bits of RAM for high-capacity data handling.
– Supports an operating temperature range of 0°C to 70°C, accommodating a broad spectrum of environmental conditions.
– Provides 189 I/O pins for extensive interfacing capabilities.

This advanced FPGA is typically utilized in sectors such as telecommunications, automotive electronics, aerospace, and defense systems, where its capacity for handling complex algorithms and processing tasks is invaluable.