Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EPF10K50VBC356-3N is a high-performance FPGA (Field-Programmable Gate Array) from the acclaimed FLEX-10K® series, designed to meet the demanding needs of advanced digital systems. This component is encapsulated in a 356-LBGA (Ball Grid Array) package, optimized for surface mount technology, ensuring a robust and reliable integration into a broad range of applications. With an operating temperature range of 0°C to 70°C, it provides a wide operational window for various environmental conditions.
With its impressive array of features including 2,880 logic elements/cells and 360 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), the EPF10K50VBC356-3N is engineered to deliver exceptional flexibility and scalability. This enables designers to create complex logic circuits and systems on a single chip, significantly reducing development time and costs. The device also boasts 20,480 total RAM bits for efficient data storage and processing, alongside 274 available I/O ports, facilitating extensive connectivity options for peripheral devices.
This FPGA is housed in a 356-BGA package with dimensions of 35x35mm, providing a compact footprint for space-constrained applications. However, potential users should note that this part is listed as obsolete, which signifies that it may no longer be in production by Intel, potentially limiting its availability for new designs. Despite this, its advanced features and performance make it a viable option for legacy systems or specific applications where the unique attributes of the EPF10K50VBC356-3N offer distinct advantages.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 356-LBGA |
Mounting Type | Surface Mount |
Number of Gates | 116000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 3V ~ 3.6V |
Number of Logic Elements/Cells | 2880 |
Supplier Device Package | 356-BGA (35x35) |
Number of LABs/CLBs | 360 |
Total RAM Bits | 20480 |
Part Status | Obsolete |
Number of I/O | 274 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
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DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
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