Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EPF10K50SQC240-1N is an advanced FPGA (Field-Programmable Gate Array) component manufactured by Intel, belonging to the high-performance FLEX-10KS® series. This FPGA is meticulously engineered to cater to a wide range of application needs, providing a potent combination of versatility and power for specialist applications in various industries from telecommunications to automotive enhancements, and industrial automation systems.
Housed in a 240-BFQFP (Quad Flat Package), the EPF10K50SQC240-1N offers a surface mount solution that facilitates streamlined PCB (Printed Circuit Board) design and manufacturing processes. It operates within the standard temperature range of 0°C to 70°C, ensuring reliability across different environmental conditions.
With its 2880 logic elements/cells and 360 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), this FPGA enables the implementation of complex logic functions and designs. Storage is amply provided with 40,960 total RAM bits, facilitating efficient data handling and processing capabilities. This is complemented by a substantial number of I/O pins, totaling 189, which support extensive connectivity options for peripheral devices and external modules, enhancing system flexibility and expandability.
The package is delivered in a tray format, indicating a consideration for safe transportation and storage, ensuring the integrity of the components until they are ready for use. Notably, the EPF10K50SQC240-1N holds an ‘Obsolete’ part status, which is critical information for long-term project planning and support considerations, especially in applications requiring stringent lifecycle management and sustainability assessments.
Overall, the EPF10K50SQC240-1N from Intel’s FLEX-10KS® series represents a robust solution for projects demanding high-performance FPGA functionality, providing a balance between advanced technical features and practical design requirements.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 240-BFQFP |
Mounting Type | Surface Mount |
Number of Gates | 199000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 2880 |
Supplier Device Package | 240-PQFP (32x32) |
Number of LABs/CLBs | 360 |
Total RAM Bits | 40960 |
Part Status | Obsolete |
Number of I/O | 189 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
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DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
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