The EPF10K50RC240-3 is a high-quality Field-Programmable Gate Array (FPGA) from Intel, belonging to the renowned FLEX-10K® series. This component, packaged in a 240-BFQFP Exposed Pad, is designed to meet the rigorous demands of surface-mount technology applications. With an operating temperature range of 0°C to 70°C, it ensures reliable performance across various environmental conditions.

At the core of the EPF10K50RC240-3 are 2,880 logic elements/cells and 360 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing a robust platform for complex digital circuits. The device also boasts a substantial amount of embedded memory, offering a total of 20,480 RAM bits to support a wide array of computing and data storage needs.

Notably, the FPGA comes with 189 I/O pins, enabling versatile connectivity options with other components in a system. Housed in a 240-RQFP package (32×32), it fits efficiently into compact designs while allowing for efficient heat dissipation thanks to its exposed pad design.

Though marked as obsolete, the EPF10K50RC240-3 remains a valuable component for legacy systems in various sectors, including telecommunications, consumer electronics, and automotive industries, among others.

Key features include:
– Part of Intel’s FLEX-10K® series
– Surface Mount, 240-BFQFP Exposed Pad package
– Operating temperature range: 0°C ~ 70°C
– 2,880 logic elements/cells and 360 LABs/CLBs
– 20,480 total RAM bits
– 189 I/O pins
– Designed for use in telecommunications, consumer electronics, and automotive applications.