Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EPF10K30RC240-3N, manufactured by Intel, belongs to the FLEX-10K® series of Field Programmable Gate Arrays (FPGAs), renowned for their high flexibility and performance. This component, now considered obsolete, is presented in a 240-BFQFP (Ball Flat Quad Flat Package) with an exposed pad, optimized for surface mount technology, ensuring robust and reliable integration into a multitude of electronic assemblies.
With an operating temperature range of 0°C to 70°C, it is designed to cater to a wide range of environmental conditions, enhancing its suitability for applications across various industries. The FPGA features 1,728 logic elements/cells, organized into 216 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing substantial logic capacity for complex digital circuits.
It incorporates a total of 12,288 RAM bits for efficient data storage and manipulation, emphasizing its capability to handle substantial memory requirements. The device supports 189 Input/Output (I/O) ports, facilitating versatile connectivity options for multiple peripherals and interfaces.
Housed in a 240-RQFP package measuring 32×32, this component aims at streamlined integration into electronic systems, prioritizing space-saving without compromising on performance. Despite its status as an obsolete part, the EPF10K30RC240-3N remains a valued choice for designers and engineers looking for a reliable FPGA solution from the trusted FLEX-10K® product line, offering a blend of advanced technology and enduring performance for legacy systems across diverse operational demands.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 240-BFQFP Exposed Pad |
Mounting Type | Surface Mount |
Number of Gates | 69000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 4.75V ~ 5.25V |
Number of Logic Elements/Cells | 1728 |
Supplier Device Package | 240-RQFP (32x32) |
Number of LABs/CLBs | 216 |
Total RAM Bits | 12288 |
Part Status | Obsolete |
Number of I/O | 189 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 177 I/O 256FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 315 I/O 484FBGA
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