Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EPF10K30RC240-3 from Intel is a crucial component in the realm of Field Programmable Gate Arrays (FPGAs), falling within the highly regarded FLEX-10K® series known for its versatility and performance. Crafted for surface mount applications, it features a sophisticated 240-BFQFP Exposed Pad package that ensures optimal thermal management and reliability in operation.
With an operating temperature range of 0°C to 70°C, this FPGA is designed to maintain consistency and precision across various environmental conditions. It boasts a comprehensive array of 1728 logic elements/cells, underpinned by 216 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), making it a powerhouse for complex digital circuit designs. The inclusion of 12288 total RAM bits provides ample memory resources for high-demand applications, further enhancing its utility in demanding scenarios.
The device accommodates a substantial number of I/O ports, with 189 available, enriching its capacity to interface with a wide array of external devices and systems. Encased in a 240-RQFP (32×32) package, it combines robust performance with a compact form factor, ideal for sophisticated electronic designs.
Although now classified as obsolete, the EPF10K30RC240-3 continues to be a valued component in legacy systems across various industries, including telecommunications, automotive, and consumer electronics, where its reliability and performance characteristics are unmatched. Its legacy underscores Intel’s long-standing commitment to innovation and excellence in the semiconductor industry, making it a pivotal component for specialists seeking to maintain or repair advanced electronic systems.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 240-BFQFP Exposed Pad |
Mounting Type | Surface Mount |
Number of Gates | 69000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 4.75V ~ 5.25V |
Number of Logic Elements/Cells | 1728 |
Supplier Device Package | 240-RQFP (32x32) |
Number of LABs/CLBs | 216 |
Total RAM Bits | 12288 |
Part Status | Obsolete |
Number of I/O | 189 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 532 I/O 780FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 176 I/O 256UBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |