The EPF10K200SRC240-1X is a high-performance FPGA from Intel’s renowned FLEX-10KS® series, designed to meet the complex digital logic design needs of advanced technical fields. This component comes in a 240-BFQFP Exposed Pad package, optimized for efficient heat dissipation and surface mount technology for secure and reliable integration onto PCBs. Featuring an expansive array of 182 I/O ports, this FPGA allows for flexible and extensive interfacing with other components, making it an excellent choice for projects requiring high-speed data transfer and multifunctional capabilities.

Operating within a temperature range of 0°C to 70°C (TA), the EPF10K200SRC240-1X is engineered to maintain its performance under standard industrial conditions, ensuring reliability across various applications. Its packaging in bulk form allows for efficient procurement and inventory management by professionals in the field.

As part of the FLEX-10KS® series, this FPGA is explicitly crafted to provide superior logic density, user-definable I/O standards, and comprehensive in-system programmability, thereby offering a robust platform for developing complex digital systems. Its supplier device package, identified as 240-RQFP (32×32), further highlights its compact form factor designed for space-conscious applications without compromising on functionality.

Widely acknowledged for its versatility, the EPF10K200SRC240-1X is a go-to component across industries including telecommunications, automotive electronics, and consumer electronic devices, among others, where its capacity for efficient data processing and system control is invaluable. With its status as an active part, Intel affirms ongoing support and availability, making it a reliable choice for both current and future high-end projects requiring advanced FPGA solutions.