The EPF10K200SBC600-1, a Field-Programmable Gate Array (FPGA) crafted by Intel, is a member of the esteemed FLEX-10KS® series. This component is notable for its surface mount, 600-Ball Grid Array (BGA) packaging, designed to fit precisely within a 45×45 mm footprint. Engineered for reliability and high performance, it operates efficiently across a temperature range of 0°C to 70°C (TA), ensuring stability in various working conditions.

With an impressive configuration of 9,984 logic elements/cells and 1,248 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA is geared towards complex logic operations. It also boasts a substantial memory capacity with 98,304 total RAM bits to support data-intensive applications. The inclusion of 470 I/O ports offers unparalleled connectivity options, facilitating versatile integration into larger systems.

Although now classified as obsolete, the EPF10K200SBC600-1 remains a sought-after component for its robustness and flexibility in application. Historically, devices in the FLEX-10KS® series have been widely utilized across various industries, including telecommunications, automotive, and consumer electronics, for tasks ranging from signal processing to power management solutions.

Intel’s dedication to innovation and quality is exemplified in this FPGA, making it a preferred choice for developers seeking high-capacity, reliable solutions for their complex circuit designs. Despite its discontinuation, the EPF10K200SBC600-1 continues to be a valuable asset for projects requiring a blend of high performance and connectivity.