Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EPF10K10TC144-3N is a high-performance FPGA from the FLEX-10K® series, tailored for advanced applications requiring a complex array of logic elements and high I/O count. This device is built in a 144-LQFP package, designed specifically for surface mount technology to ensure a robust and reliable integration into a wide array of electronic assemblies. Operating within a temperature range of 0°C to 70°C, it offers versatility for various operational environments.
Key Specifications:
– Manufacturer: Intel
– Series: FLEX-10K®
– Packaging: Tray, ensuring safe transport and handling
– Package/Case: 144-LQFP, optimized for surface mount assembly
– Operating Temperature Range: 0°C ~ 70°C, suitable for standard industrial applications
– Logic Elements/Cells: 576, for complex logic circuit implementations
– Supplier Device Package: 144-TQFP (20×20), providing a compact form factor
– LABs/CLBs: 72, enabling a flexible and efficient logic design
– Total RAM Bits: 6144, for efficient data storage and manipulation
– Part Status: Obsolete, highlighting its utilization in legacy systems
– I/O Count: 102, offering extensive interfacing capabilities
The Intel EPF10K10TC144-3N has been a component of choice across various industries, including but not limited to telecommunications, automotive systems, and consumer electronics, for its reliability and flexibility in designing complex electronic systems. The combination of its extensive logic cell count, significant I/O options, and manageable package size makes it an ideal choice for engineers looking to innovate or maintain existing systems within these sectors. Despite its status as an obsolete part, its capabilities continue to be recognized and utilized in specialized applications requiring high performance and specific legacy compatibility.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 144-LQFP |
Mounting Type | Surface Mount |
Number of Gates | 31000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 4.75V ~ 5.25V |
Number of Logic Elements/Cells | 576 |
Supplier Device Package | 144-TQFP (20x20) |
Number of LABs/CLBs | 72 |
Total RAM Bits | 6144 |
Part Status | Obsolete |
Number of I/O | 102 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA ARTIXUP 484BGA
IC FPGA 475 I/O 672FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 226 I/O 324CSBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |