Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EPF10K100EQC240-3N from Intel, belonging to the distinguished FLEX-10KE® series, is a high-performance FPGA (Field Programmable Gate Array) encapsulated in a 240-BFQFP (Bumpered Flat Quad Flat Package). This device offers unparalleled flexibility with its array of 4992 logic elements/cells and 624 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), designed to meet the demanding needs of complex digital systems. The FPGA operates over a temperature range from 0°C to 70°C, ensuring reliability in a diverse range of operating conditions.
With its substantial offering of 189 I/O pins, this component caters to intricate system requirements, providing ample connectivity options. The device is supported by a surface mount technology for streamlined assembly processes, packaged in trays for secure handling and delivery. Additionally, it features a total RAM bit count of 49152, offering significant on-chip storage capabilities to manage data-intensive applications efficiently.
Given its impressive technical specifications, the EPF10K100EQC240-3N is ideally suited for use across various industries including telecommunications, automotive, and consumer electronics, where it’s leveraged for its computational power and configurability in handling intricate signal processing and data management tasks. Despite its classification as obsolete, the component remains a valuable resource for developers and engineers looking to harness the power of FLEX-10KE® technology in their existing or legacy systems. The packaged dimensions for the device fall within a 240-PQFP (32×32), making it a space-efficient component for printed circuit board (PCB) design and layout.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 240-BFQFP |
Mounting Type | Surface Mount |
Number of Gates | 257000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 4992 |
Supplier Device Package | 240-PQFP (32x32) |
Number of LABs/CLBs | 624 |
Total RAM Bits | 49152 |
Part Status | Obsolete |
Number of I/O | 189 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 83 I/O 100QFP
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 315 I/O 484FBGA
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