Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EPF10K100EFC484-1N is a high-performance FPGA from the FLEX-10KE® series, recognized for its exceptional logic integration capabilities and designed to meet the rigorous demands of a wide range of applications. Packaged in a 484-ball Fine-Pitch Ball Grid Array (FBGA) with dimensions of 23×23, this component lends itself to efficient surface mount technology, facilitating streamlined PCB design and assembly processes.
With an operating temperature range of 0°C to 70°C, this FPGA provides a reliable solution for designs requiring stable performance under standard industrial conditions. The device boasts 4,992 logic elements/cells, arranged into 624 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), enabling the creation of intricate logic functions and designs. Furthermore, it is equipped with 49,152 total RAM bits, offering substantial data storage capacity for complex processing tasks.
The EPF10K100EFC484-1N supports 338 I/O pins, allowing for versatile connectivity options with other components within a system. This makes it an excellent choice for applications in telecommunications, networking, and industrial automation, where a high degree of interfacing and communication is necessary.
Although marked obsolete, the EPF10K100EFC484-1N remains a sought-after component for legacy systems and specialized applications where its unique characteristics and proven performance align with specific technical requirements. Its robust feature set and proven reliability exhibit Intel’s commitment to delivering high-quality, powerful solutions for the FPGA market.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BBGA |
Mounting Type | Surface Mount |
Number of Gates | 257000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 4992 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 624 |
Total RAM Bits | 49152 |
Part Status | Obsolete |
Number of I/O | 338 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 341 I/O 484FBGA
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IC FPGA 177 I/O 256FBGA
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IC FPGA 176 I/O 256UBGA
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