Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP4CGX150CF23C7N is a high-performance FPGA from the Cyclone® IV GX series, designed to tackle the demanding needs of various applications across industries like telecommunications, automotive, and data processing. This product comes packed in trays, ensuring safe delivery and storage. It features a 484-ball fine-pitch grid array (484-BGA) package which facilitates surface mount technology, making it compatible with modern high-density circuit designs.
Notable technical specifications of the EP4CGX150CF23C7N include:
– Package / Case: 484-BGA, making it suitable for compact designs that require high performance in a small footprint.
– Mounting Type: Surface Mount, ensuring compatibility with automated PCB assembly processes.
– Operating Temperature Range: 0°C to 85°C, offering reliable performance in a wide range of environmental conditions.
– Number of Logic Elements/Cells: 149,760, providing ample logic resources for complex digital circuitry.
– Supplier Device Package: 484-FBGA (23×23), indicating the form factor and pin configuration.
– Number of LABs/CLBs: 9,360, allowing for flexible and efficient logic implementation.
– Total RAM Bits: 6,635,520, enabling significant data storage and manipulation within the FPGA.
– Part Status: Active, ensuring ongoing availability and support.
With 270 available I/O ports, this FPGA is designed to accommodate a wide variety of interfacing requirements, allowing for versatile connectivity options. This component represents Intel’s commitment to delivering advanced technologies that support the development of innovative systems across a broad spectrum of applications, making it a preferred choice for professionals seeking robust, flexible, and high-performance FPGA solutions.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.16V ~ 1.24V |
Number of Logic Elements/Cells | 149760 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 9360 |
Total RAM Bits | 6635520 |
Part Status | Active |
Number of I/O | 270 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 72 I/O 84PLCC
IC FPGA 532 I/O 780FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |